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Home / Our Products / Hydrogen Peroxide (H₂O₂)

Features of Hydrogen Peroxide

Chemical Properties

The most important chemical property of Hydrogen Peroxide is its ability to provide “active oxygen” to the process concerned. Active oxygen can be explained thus:

In most inorganic and organic compounds which contain oxygen(e.g. water, metal oxides, alcohols, carbonates, etc.), the oxygen atom is bound to another type of atom and cannot be easily split off. Hydrogen Peroxide, on the other hand, contains the group -O-O- in which the two oxygen atoms are directly coupled to each other. The oxygen-oxygen link in such compounds can be broken, liberating one atom as “active oxygen”.

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Hydrogen Peroxide (H₂O₂) is a safe and efficient sterilizing agent widely used in aseptic food packaging to ensure product safety and long shelf life.

Why It Is Used
  • Kills harmful microorganisms such as bacteria, yeast, mold, and spores.
  • Breaks down into water and oxygen, leaving no harmful residues.
  • Approved by global food safety authorities for use in packaging sterilization
How It Works in Aseptic Packaging
  1. Applied to packaging material (cartons, PET/HDPE bottles, caps) as a liquid, spray, or vapor.
  2. Activated by heat (hot air or infrared) to achieve microbial sterilization.
  3. Drying step ensures minimal residue, making the packaging safe for food contact.
  4. UHT/ESL products are filled in a sterile environment and sealed immediately.
Where It Is Used
  • Milk and dairy beverages
  • Juices and nectars
  • Plant-based drinks
  • Liquid foods, soups, sauces, and purees
Benefits
  • Ensures long shelf life without refrigeration
  • Maintains product quality and safety
  • Environmentally friendly—no chemical by-products
  • Compatible with modern high-speed aseptic filling lines
Typical Concentration
  • 35% Food Grade Hydrogen Peroxide is commonly used in industrial aseptic systems.
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Application of Hydrogen Peroxide in Solar Cell Modules

Hydrogen Peroxide is used in solar cell module manufacturing as a high‑purity oxidizing and cleaning agent. It helps remove organic residues, metals, and surface contaminants from silicon wafers and module components, ensuring better adhesion, improved light absorption, and consistent cell performance. H₂O₂ is also used in etching, texturization, and equipment cleaning processes, contributing to higher module efficiency and reliability. Because it decomposes into water and oxygen, it offers a clean, safe, and environmentally friendly solution for solar module production.